Technical Capability | Gem Circuits

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Standard/Technical Capability

	Technical Capability
Layer count	1-16 layers
Base material	FR4 Tg140/Tg170/Tg180, Aluminium 1W/m.K or 2W/m.K
Max board size	500mm x 800mm
Copper thickness	Outer:1-4oz, Inner:1-4oz
Board thickness (mm)	0.4, 0.6, 0.8, 1.0, 1.2, 1.6, 2.0, 2.4, 2.8, 3.0, 3.2
Solder mask	Green, black, white, blue, red, yellow, matt green, blue or black
Silkscreen ident	White, black, red, or yellow
Min track/gap thickness	4 mil (0.1mm)
Min hole size	8 mil (0.2 mm)
Surface finish	HASL, lead-free HAL, Immersion Gold (1U",2U" or 3U"), OSP, Immersion Silver or Tin
Other masks/inks	Peelable, Carbon
Impedance Control	50-80Ω for single ended, 85-110Ω for differential

Toggle between and Capability

	Standard Capability
Layer count	1-6 layers
Base material	FR4 Tg140, Aluminium 1W/m.K, CEM-1
Max board size	500mm x 600mm
Copper thickness	1oz, 2oz
Board thickness (mm)	0.4, 0.6, 0.8, 1.0, 1.2, 1.6, 2.0
Solder mask	Green, black, white, blue, red, yellow, matt black or green
Silkscreen ident	White, black, red, or yellow
Min track/gap thickness	5.0 mil (0.127mm)
Min hole size	10 mil (0.25 mm)
Surface finish	HASL, lead-free HAL, Immersion Gold (1U" or 2U"), OSP
Impedance Control	50Ω, 90Ω, 100Ω

Our technical capability lists some of the more challenging specifications that we may be able to manufacture, our standard specification lists our recommendations to ensure cheaper prices.

If your board conforms to our standard or technical specification, use our online quote system to get an instant price. For more challenging technical requirements (or if in doubt) please use our standard enquiry service.